Electronic thin film reliability / King-Ning Tu.
Material type: TextPublication details: Cambridge ; New York : Cambridge University Press, 2011.Description: xvi, 396 p. : illISBN:- 9780521516136
- 621.3815/2
Item type | Current library | Home library | Call number | Status | Date due | Barcode | |
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Book | Dept. of Optoelectronics Processing Center | Dept. of Optoelectronics | 621.38152 TU/E (Browse shelf(Opens below)) | Available | DOP1827 |
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621.38152 SUR/S Solid state technology | 621.38152 SUR/S1 Solid state technology | 621.38152 SUR/S2 Solid state technology | 621.38152 TU/E Electronic thin film reliability / | 621.38152 TYA/I Introduction to semiconductor materials and devices | 621.38152 TYA/S Introduction to semiconductor materials and dvices | 621.38152 VAS/C Computational electronics |
Includes bibliographical references and index.
"Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners"--
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