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Adhesive bonding in photonics assembly and packaging / B.G. Yacobi and M. Hubert. by
Material type: Text Text
Publication details: Stevenson Ranch, Calif. : American Scientific, c2003
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Availability: Items available for loan: Dept. of Optoelectronics (1)Call number: 621.36 YAC/A.
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Extended defects in semiconductors: Electronic properties, device effects and structures by Series:
Edition:
Material type: Text Text
Publication details: Cambridge University Press, Cambridge 2007
Availability: Items available for loan: Dept. of Physics (1)Call number: 621.38152 HOL-E.
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Extended defects in semiconductors: electronic properties, device effects and structures by Series:
Edition:
Material type: Text Text
Publication details: Cambridge University Press, London 2007
Availability: Items available for loan: Dept. of Physics (1)Call number: 620.38152 HOL-E.
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