Thermal management materials for electronic packaging : preparation, characterization, and devices
Material type: TextPublication details: Germany: Wiley VCH GmbH, 2024.Description: xvii,341pISBN:- 9783527352425
Item type | Current library | Home library | Collection | Call number | Status | Date due | Barcode | |
---|---|---|---|---|---|---|---|---|
Book | Dept. of Physics General Stacks | Dept. of Physics | Non-fiction | 621.381 TIA-T (Browse shelf(Opens below)) | Available | PHY8964 |
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621.38 ROD-E4 Electronic communication | 621.38028 KAL-N Near field antenna measurements : calculations and facility design | 621.381 PAN-F Fundamentals of electroceramics : materials, devices, and applications / | 621.381 TIA-T Thermal management materials for electronic packaging : preparation, characterization, and devices | 621.381045 LUT-O Optoelectronics : principles and practices | 621.381078 NAV-E6 Electronics Lab Manual Vol. II / Dr. Navas , K. A. | 621.381078 NAV-E6 Electronics Lab Manual Vol. II / Dr. Navas , K. A. |
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