Amazon cover image
Image from Amazon.com
Image from Google Jackets
Image from OpenLibrary

Micro and Nano Fabrication : Tools and Processes / by Hans H. Gatzen, Volker Saile, Jürg Leuthold.

By: Contributor(s): Material type: TextTextEdition: 1st ed. 2015Description: 1 online resource (XXVI, 519 pages 357 illustrations, 54 illustrations in color.)ISBN:
  • 9783662443958
Subject(s): DDC classification:
  • 620.5
Contents:
Introduction-MEMS, a Historical Perspective -- Vacuum Technology -- Deposition Technologies -- Etching Technologies -- Doping and Surface Modification -- Lithography -- LIGA -- Nanofabrication by Self-Assembly -- Enabling Technologies I - Wafer Planarization and Bonding -- Enabling Technologies II - Contamination Control -- Device Fabrication - An Example.
Summary: For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. This book provides a comprehensive insight into the tools necessary for fabricating MEMS/NEMS and the process technologies applied. Besides, it describes enabling technologies which are necessary for a successful production, id est, wafer planarization and bonding, as well as contamination control.
Tags from this library: No tags from this library for this title. Log in to add tags.

Introduction-MEMS, a Historical Perspective -- Vacuum Technology -- Deposition Technologies -- Etching Technologies -- Doping and Surface Modification -- Lithography -- LIGA -- Nanofabrication by Self-Assembly -- Enabling Technologies I - Wafer Planarization and Bonding -- Enabling Technologies II - Contamination Control -- Device Fabrication - An Example.

For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. This book provides a comprehensive insight into the tools necessary for fabricating MEMS/NEMS and the process technologies applied. Besides, it describes enabling technologies which are necessary for a successful production, id est, wafer planarization and bonding, as well as contamination control.

There are no comments on this title.

to post a comment.